The smartModule is a highly compact solution (33 × 27 × 3 mm) designed for seamless integration into customer platforms. It incorporates NXP’s 802.11p radio chipset and an integrated Hardware Security Module (HSM), ensuring secure and reliable V2X connectivity.

Equipped with an onboard PMIC, the smartModule eliminates the complexity of RF and power design, making it easy to integrate into custom mainboards. It supports multiple I/O voltage levels (1.8 V and 3.3 V) and provides flexible host connectivity via SDIO or SPI.

Developed to meet QM-grade quality standards and operating across a wide temperature range of –40 °C to +105 °C, the smartModule delivers robust performance in demanding automotive and industrial environments.